1. 제 목 : Manufacturing Process and Reliability of Advanced Materials, MEMS and IC Devices





2. 연 사 : Prof. Sung Yi


(School of Mechanical and Production Engineering,


Nanyang Technological University, Singapore )





3. 일 시 : 2001년 11월 2일 (금요일) 16:00





4. 장 소 : Nanyang Technological University(Singapore) :실제강의장소


한양대 공업센터 4층 세미나실(화상강의로 진행)


서울대 신공학관(301동) 1512호 세미나실 (화상강의로 진행)





5 . 내 용 : The manufacturing technology for materials, MEMS and IC devices significantly affects the overall cost, their performance and reliability. Especially, during manufacturing, the materials and devices have become increasingly susceptible to dimensional instability, defects, and internal residual stresses due to chemical shrinkages and thermal expansion mismatch among the materials and components. For example, a hygro-thermally induced failure in plastic encapsulated IC packages that occurs during the surface mounting process is the major reliability problem in electronic packaging. It is, therefore, most important to properly understand the effects of moisture/temperature distributions and degrees of cure on the mechanical behavior of polymeric encapsulation materials in order to guarantee dimensional stability of IC devices. The second example is underfilling process of flip chips, which involves dispensing a controlled amount of silicon filled epoxy into a gap between chips and substrates. Incomplete filling and void formation are common reliability problems during underfilling process. Last, in a silicon condenser microphone, the thermal stresses induced by the oxide and wafer bonding are very important and will significantly affect the performance of the silicon condenser microphone. The manufacturing process induced stresses make the diaphragm very stiff


and low the sensitivity of the microphone.





6. 문 의 : : 한양대 BK21 기계분야 사업단 행정실 (전화 : 2290-1263,4)





7. 기계분야 박사과정 세미나 수업 수강자 참석 요망