Samsung C&T Corporation 2013 Global Internship Notice

Samsung C&T Engineering &Construction Group has been in business for 34 years.
We are committed to becoming the world's leading contractor through the constant pursuit of growth, and through the quality in our leadership.
We'd like to conduct a global internship program for foreigers who are university students in Korea.

Employer : Samsung C&T Corporation(Engineering &Construction Group)
Position : Intern
Duration : 4 weeks (During the winter vacation)
Location : Samsung C&T HQ in Seoul, South Korea (nearby Gangnam Station)

Description :
- 4 weeks internship program, including 1 week of training
- Global marketing research and management support tasks
- Compensation including lunch and a stipend of KRW 1,200,000
- Possible job opportunities to work for Samsung C&T Corporation after evaluation will from the internship PGM ; high level prospect will receive offers.

Qualifications :
- Eligible applicants : Foreign students in domestic University or graduate school (Feb. / Aug. 2014 prospective graduates)
- Major : Constuction / Civil / Mechanical / Electrical and Electronic, all of Humanities majors (including Business Administration)
- GPA : above 3.0(4.5 standard)
- Honors of D-2 Visa only

Recruitment Schedule :
- Application period : September 12th ~ 25th, 2013
- Register the application(www.samsung.com) : Sep. 23rd~27th (selected applicants only)
- Samsung Aptitude Test : October 13th, 2013
- Interview : Nov. (Contacted by HR for interview opportunity)

How to Apply :
- Download and Complete the "Application and Recommendation Form" attatched below
- Submit your application form and letters of recommendation from Professors to seccrecruit@samsung.com by September 12th~25th. 2013
- The result and detailed information for registration of the application will be noticed by E-mail from September 23rd to 26th inclusive.

For further information please contact us. (tel. 02.2145.5453, seccrecruit@samsung.com)
If you are interested in the program, please find the attachments.