세미나 및 이벤트
High Temperature Chemically Reacting Flows:Fundamentals and Applications
세미나 날짜
2001-03-21
작성자
손문숙
작성일
2001-03-21
조회
1051
1. 제 목 : High Temperature Chemically Reacting Flows:
Fundamentals and Applications
2. 연 사 : Joong Soo Kim, Ph.D.
Technology Development
Conductor Etch Technology and Engineering
Lam Research Corporation
3. 일 시 : 2000년 12월 28일(목) 15:00-16:00
4. 장 소 : 301동 1512호
5. 내 용 : Emerging areas of thermal transport science will be presented, focusing on the fundamentals of plasmas and combustion and their applications. As an example, low-pressure glow discharges are indispensable in the fabrication of microelectronic circuits. These plasmas are used to deposit materials and also etch fine features in device fabrication, such as micro electrical mechanical systems (MEMS). However, many plasma-based processes suffer from stability and reliability problems leading to a compromise in performance and a potentially increased cost for the semiconductor manufacturing industry. Although a great deal of laboratory-scale research has been performed on many of these processing plasmas, little is known about the gas-phase and surface chemical reactions that are critical in many etch and deposition processes, and how these reactions are influenced by the variation in operating conditions. Such a lack of understanding has hindered the development of process models that can aid in the scaling and improvement of plasma etch and deposition systems.
In this presentation, a research collaboration between Stanford University and NASA-Ames Research Center in the study of plasma physics and chemistry will be overviewed.
6. 문 의 : 기계항공공학부 정 석 호 교수(880-7114)
Fundamentals and Applications
2. 연 사 : Joong Soo Kim, Ph.D.
Technology Development
Conductor Etch Technology and Engineering
Lam Research Corporation
3. 일 시 : 2000년 12월 28일(목) 15:00-16:00
4. 장 소 : 301동 1512호
5. 내 용 : Emerging areas of thermal transport science will be presented, focusing on the fundamentals of plasmas and combustion and their applications. As an example, low-pressure glow discharges are indispensable in the fabrication of microelectronic circuits. These plasmas are used to deposit materials and also etch fine features in device fabrication, such as micro electrical mechanical systems (MEMS). However, many plasma-based processes suffer from stability and reliability problems leading to a compromise in performance and a potentially increased cost for the semiconductor manufacturing industry. Although a great deal of laboratory-scale research has been performed on many of these processing plasmas, little is known about the gas-phase and surface chemical reactions that are critical in many etch and deposition processes, and how these reactions are influenced by the variation in operating conditions. Such a lack of understanding has hindered the development of process models that can aid in the scaling and improvement of plasma etch and deposition systems.
In this presentation, a research collaboration between Stanford University and NASA-Ames Research Center in the study of plasma physics and chemistry will be overviewed.
6. 문 의 : 기계항공공학부 정 석 호 교수(880-7114)
